Atmel RoHS and Green Packaging

Atmel began introducing Pb-free packages in the late 1990's with our LAP laminate package family. Since then we have aggressively developed Pb-free or fully Green packages and now provide offerings in virtually every available package footprint in accordance with customer demand as well as legislative directives such as RoHS 2002/95/EC. Our Green Package Program is part of Atmel's Corporate Environmental Policy.

Details of the Green Package Program are outlined in our Corporate Pb-Free / Green Packaging Policy (CPQ-2022). Leadframe products are fully backward compatible to Pb-containing solder paste. For Ball Grid Array packages, SnAgCu solder balls are used and all reflow profiles are targeted to meet the latest revision of J-STD-020. All packages are topside marked to distinguish from Pb-containing versions using a single character code and labeling is targeted to meet JESD97 requirements.