Whether it is found in paint, in gasoline, or in packaging for technology products, lead raises serious environmental concerns because of its harmful effects. In the late 1990's, the potential toxicity of lead spurred Atmel® to introduce alternative lead-free packages.
Since those early days, Atmel has aggressively developed lead-free and environmentally sensitive packaging for virtually every available product we produce. We do this as part of our commitment to "Green" practices. Our customers demand it and it is simply the right thing to do.
We have found that choosing lead-free or environmentally sensitive packaging does not reduce product quality. Leadframe products are fully backward compatible to lead-containing solder paste. SnAgCu solder balls are used in ball grid array packages, with all reflow profiles targeted to meet the latest revision of J-STD-020.
You can tell if an Atmel package is lead-free by the single character code on the topside. Our labeling meets J-STD-609 requirements.
Contact your local Atmel Sales Representative for a copy of Atmel's Tin Whisker Report.